1st International EOS/ESD Symposium on Design and System (IEDS), June 23~25, 2021 at Chengdu, People Republic of China (P.R.C.)
Everfeed supports the EOS/ESD Association, Inc. 1st IEDS in Chengdu, P.R.C. from June 23~25, 2021.
EOS/ESD Association, Inc. is sponsoring the 1st International EOS/ESD Symposium on Design and System (IEDS). IEDS 2021 is dedicated to the fundamental understanding of issues related to electrostatic discharge on design and system and the application of this knowledge to the solution of problems. The Technical Program Committee solicits symposium contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to on-chip ESD design, system ESD design, and EOS/ESD issues in manufacturing. The Technical Program Committee is inviting papers related, but not limited, to the following tracks:
Advanced CMOS EOS/ESD and Latch-up
ESD protection in Bipolar, RF, High-voltage, and BCD technologies
ESD modeling, simulation and design automation
EOS/ESD Failure analysis and case studies
ESD and latch-up testing
System ESD design and troubleshooting issues
ESD manufacturing control issues and target level discussion
Awards are presented annually for the Symposium Outstanding Paper and Best Student
Paper Award (selected by the Technical Program Committee). The Outstanding Paper is considered for presentation at the Annual EOS/ESD Symposium. Eligible student contributions for the Best Student Paper Award should be marked as such by the authors at the time of abstract submission.
June 23~25, 2021 at The Ritz-Carlton, 269 Shuncheng Avenue, Qingyang District, Chengdu, Sichuan, 610017 China
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