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2022 2nd IEDS, Chengdu, P.R.C

Updated: Dec 18, 2021

2nd International EOS/ESD Symposium on Design and System (IEDS), November 9~11, 2022 at Chengdu, People Republic of China (P.R.C.)


Call for Papers now...

Everfeed supports the EOS/ESD Association, Inc. 2nd IEDS in Chengdu, P.R.C. from November 9~11, 2022.


EOS/ESD Association, Inc. is sponsoring the 2nd International EOS/ESD Symposium on Design and System (IEDS). IEDS 2022 is dedicated to the fundamental understanding of issues related to electrostatic discharge on design and system and the application of this knowledge to the solution of problems. The Technical Program Committee solicits symposium contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to on-chip ESD design, system ESD design, and EOS/ESD issues in manufacturing. The Technical Program Committee is inviting papers related, but not limited, to the following tracks:

  • Advanced CMOS EOS/ESD and Latch-up

  • ESD protection in Bipolar, RF, High-voltage, and BCD technologies

  • ESD modeling, simulation and design automation

  • EOS/ESD Failure analysis and case studies

  • ESD and latch-up testing

  • System ESD design and troubleshooting issues

  • ESD manufacturing control issues and target level discussion



Event Highlights


Awards are presented annually for the Symposium Outstanding Paper and Best Student

Paper Award (selected by the Technical Program Committee). The Outstanding Paper is considered for presentation at the Annual EOS/ESD Symposium. Eligible student contributions for the Best Student Paper Award should be marked as such by the authors at the time of abstract submission.


Important Dates


April 01, 2022


April 22, 2022

Notification of Acceptance


July 11, 2022

Author Registration/Final Paper

Submission Deadline.

Submission Guidelines

Authors must submit a maximum 50-word abstract and 4-page maximum summary of their work. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors suggest the technical area related to their submission. Abstract submissions can be made electronically at:


Organizing Committee


Role

Representative

Organization

Conference Chair Emeritus

​Junjun Li

ESDA

Conference Chair

Shurong Dong

Zhejiang University

​Conference Co-Chair

Chun-Yu Lin

National Taiwan Normal University

Technical Program Chair

Yuan Wang

Peking University

Technical Program Co-Chair

Zhiwei Liu

University of Electronics Science and Technology of China

Workshop Chair

Jie Zeng

GLOBALFOUNDRIES

​Publicity Chair

Xiangliang Jin

Hunan Normal University

​Publicity Chair

Guangyi Lu

HiSilicon

Publicity Chair

Yulong Zhu

Hanwa

Publicity Chair

​Xiaozong Huang

​CETC-24

Publicity Chair

Marcus Koh

​Everfeed Technology

​Conference Technical Advisor

Nathaniel Peachey

Qorvo, ESDA Senior Vice President

Conference Program Advisor

Lisa Pimpinella

ESDA Executive Director



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